Think Center of Excellence
Binghamton's small-scale electronics powerhouse will make the region and New York state a vital nerve center in the technology race.
Hard work, dedication and vision laid the groundwork for the Center of Excellence (COE) designation, awarded to the University's already successful Small Scale Systems Integration and Packaging Center (S3IP.) With continuing support, the COE promises to enhance economic vitality through breakthrough research in electronics manufacturing and packaging.
The COE supports multidisciplinary teams that spawn innovations that turn promising ideas into marketable products. This translates into prosperity for the region, the state and COE partners through research that is helping the state remain competitive in the worldwide electronics industry.
Our COE in Small Scale Systems Integration and Packaging is making the region a vital nerve center in the technology race, generating an estimated annual impact of $100 million with its partners.
Over the next decade, research at the COE will change the face of the electronics industry through development of electronic applications for use in medical diagnostics and treatment, defense and homeland security, flexible displays and electronics, computers and telecommunications, and a broad range of new or improved consumer products.
The COE is already drawing the best faculty and researchers to its headquarters at Binghamton University's Innovative Technologies Center (ITC) where equipment and laboratories rival those in the best research centers in the country.
More than a dozen key partners have been drawn to the exciting research at Binghamton University's COE. Among them are:
BAE Systems
General Electric
IBM
Endicott Interconnect Technologies
Kodak
Corning
Lockheed Martin
Universal Instruments
US Display Consortium
